Sputtering technology uses ion sources to gather rapidly in a vacuum to form a high-speed ion beam that bombards the surface of a solid. When the ions exchange energy with the surface atoms of the solid, the atoms on the solid surface deposit onto the substrate surface. Sputtering technology is usually used for surface coating of thin film materials, and rare earth compounds are common sputtering target materials. Sputtered thin-film materials have shown great application potential in the semiconductor industry, in the fields of chemical vapor deposition (CVD) and physical vapor deposition (PVD). The controllable thin-layer coating of materials has developed into a mature technology. At present, the sputtering technology of rare earth compounds has been widely used in the fields of integrated circuits, information storage, thin-layer coating and high-temperature materials.
Alfa Chemistry offers high quality rare earth sputtering target materials for efficient thin layer coatings. The related products we can provide include:
Rare earth sputtering target for efficient thin layer coating. The principle of sputtering is to use high energy to sputter out the surface components of the material in the form of ions or atoms and deposit them on the surface of the substrate to form a thin layer on the surface. The factors affecting sputtering efficiency are as follows:
For different sputtering materials and substrates, precise experiments are required for precise control.
Alfa Chemistry and the world's leading team can provide high-efficiency rare earth sputtering target materials. If you are interested in our products, please contact us immediately.
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